2022SMM (17th) International Copper Summit
Publish Time: 2022-07-26 Origin: Site
On July 18, 2022, Shanghai Jinglin Packaging Machinery Co., Ltd. participated in the "2022SMM (17th) International Copper Summit" hosted by Shanghai Nonferrous Metals
Network in Yantai, Shandong province.
The summit invited many industry representative enterprises, governments, associations, domestic and foreign scientific research institutions, research institutes, etc., around the copper industry is facing a series of problems and challenges, in-depth exchange, discussion and research.
20th afternoon, our chairman Mr Zhang in "copper processing technology and application" the meeting about "copper processing industry packaging automation solutions" keynote speech, for the forum guests explained the current advanced packaging technology, and shows more than 10 a typical case for automatic packaging of copper processing industry, packing problem for metallurgical industry provides a new thought and method.
Through this summit, Jinglin packaging benefited a lot: not only understood the industry development trends, but also learned advanced concepts and technologies.
In the future, Jinglin packaging will continue to adhere to the road of innovation and development, strive to be the industry "leader" in the field of digital transformation, and help the vigorous development of China's non-ferrous metal industry!